9/12/2014 10:35:00 PM
dannzfay
Intel talked about the Core M processor platform which will soon power thin, light computers like tablets, laptops and 2-in-1s back at Computex 2014. During the same event, the chip maker also showed a reference design which was dubbed “Llama Mountain.”
As we already showed you in an earlier piece, there are about eight devices using the chip architecture in the pipeline, getting ready to launch this year like the Lenovo ThinkPad Helix 2 or ASUS Zenbook UX305. And according to the preliminary benchmarks, it appears the new processors won’t be extremely power hungry, but will be able to deliver pretty strong performance.
Intel wants to help device makers build thin, fanless systems
As we mentioned above, there are already a few designs taking advantage of the new chips, but Intel wants more device manufacturers to take up the production of fanless, thin and light tablets and laptops. And the company is promoting this end at the Intel Developer Forum, by providing the guidelines on how to build such a system. You might remember that a few days ago Intel launched the “Reference Design for Android Tablets” program, in an effort to help device manufacturer better build Android tablets. Now Intel provides a few tips on how to build a really slim and light-weight system (as seen on Liliputing).
To achieve this, manufacturers will need a small motherboard, a thin display panel and other components which have to be really compact. But Intel warns of the likelihood that such materials will heat up and get really warm when placed on a surface that doesn’t facilitate the moving of air, like a table or on your lap. Intel says that in order to avoid that device makers try and place the hottest components (CPU, motherboard and such) in an area that will not be subjected to touch. An example given is that one can place the motherboard at the center of the tab, while the battery goes on the side.
Intel wants to see really thin 2-in-1s
The company’s goal is to someday see 2-in-1 fanless designs with Core M chips, measuring less than 0.35 inches / 9mm and weighing about 1.4 lbs / 0.6 kg. Anyway, as we have already told you, the first super portables arriving under the Core M will be upon us this Christmas. The wider availability of such devices is expected for 2015, and in the meantime Intel is hoping to attract more partners onboard. Some of the most prominent names in the industry have already jumped onboard with Intel and this includes ASUS, Lenovo, Dell and HP, but more are expected to take the plunge.
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| Build a Thin, Fanless Tablet/Laptop with Core M Chips Images credits to Liliputing |
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