Samsung Galaxy S III Official Accessories Press Shots Emerge

Made official earlier this month, Samsung Galaxy S III is expected to arrive in Europe at the end of the month. North American will also have their own version of Galaxy S III, which is slated for a summer release.

Although the South Korean handset maker was a bit vague on the North American launch, there's no doubt about the fact that the Galaxy S III will hit shelves in Europe on May 30. However, the Galaxy S III was not the only device launched by Samsung on May 3. It appears that the third generation Galaxy smartphone will come with a slew of accessories, which are meant to make users' life easier while taking advantage of the phone's new features, apps and services.

It's not yet clear how many official accessories for Galaxy S III will be launched this year, but the fact that most of these accessories have been showcased behind glass does not help with the count at all. Anyway, we already know that Samsung plans to release a Wireless Charging Kit for the Galaxy S III, but the bad news is that the handset maker decided to push back the launch of this accessory to September.

Aside from that, customers will be able to purchase an interesting Samsung Galaxy S III flip cover, which can easily replace the phone's battery cover. The first press photo of the cover has just appeared online, which means it will be released around the same time frame as the phone. Secondly, there's a C-Pen stylus that can act like Galaxy Note's S-Pen, though the former does not fit anywhere inside the Galaxy S III, so it will be carried separately. There's also a special Wi-Fi hub display that will allow users to stream multimedia content via a HDMI port. 

Last but not least, Samsung will also launch a Galaxy S III holder and battery charger with dual purpose. The accessory can be user to charge the phone's battery, but also an extra battery which can be placed in its back pocket. via SlashGear

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Intel’s Thunderbolt Explained - Part I

Back when Intel’s Thunderbolt was announced we had enough insider knowledge to know it was Intel’s attempt to practically expand a system’s add-on capabilities using PCI-Express.

The Thunderbolt technology was not a connectivity endeavor. It was a system extension. With USB or FireWire you get a logic connection through a HUB or controller that’s visible to the operating system and has a special BUS through which the data is being transmitted.

The data transfer can be just as fast as the BUS would allow it to be and the controller itself would perform just as good as the PCIe lane it’s connected on. This is generally a problem with the fast USB 3.0 controllers of our days. A fast controller might be able to handle four ports, but if you have devices that could saturate the 5000 Mb/s USB 3.0 connection on the controller, the PCIe connection of the controller itself might become the limiting factor.

Lets say we have a device able to transfer data fast enough to saturate a 5000 Mb/s USB 3.0 connection. 5000 Mb/s translates into exactly 625 MB/s. Let’s say this is an external dual 2.5” drive enclosure with two cheap SSDs from ADATA or OCZ. Two such SSDs in RAID 0 will generally provide sequential read speeds of around 650 MB/s thus being a good fit for the maximum transfer of a USB 3.0 port of 625 MB/s.

A version 1.x  PCIe lane can transfer 250 MB/s so clearly a two port USB 3.0 add-on PCIe 1x card mounted into a PCIe version 1.x slot won’t be able to handle even a third of the 625 MB/s potential transfer speed of just one of the two USB 3.0 ports.

Mounting the card into a PCIe 1x slot on a PCIe 2.0 capable motherboard will yield a maximum bandwidth of 500 MB/s for the add-on USB 3.0 controller. This still isn’t enough to satisfy the transfer ability of our external SSD RAID 0 enclosure. When using a new motherboard with PCIe 3.0 support, the PCIe 1x add-on card will be serviced by a 1000 MB/s PCIe 1x 3.0 lane and will finally have enough bandwidth to fully enjoy the fast SSD RAID 0 enclosure. Using a 1x slot  on a PCIe 3.0 motherboard, one of the two USB 3.0 ports on the add-on card will be able to work at its highest theoretical speed and there is also at least 375 MB/s worth of bandwidth left to service the second USB 3.0 port on the add-on card.

On the other hand, if you’d try to connect two USB 3.0 devices capable of more than 600 MB/s transfer rates, the add-on card would require at least two PCIe 3.0 lanes with a total bandwidth of 2000 MB/s to satisfy the 1200 MB/s compound requirements of the two fast USB 3.0 external devices.

As there are no PCIe 2x slots, such an add-on card will have to have at least a  PCIe 4x slot. If we’re lucky to have a PCIe 4x slot on our PCIe 3.0 motherboard and a high performance USB 3.0 add-on card with a PCIe 4x connector, we could have at least six full-speed USB 3.0 ports available on the add-on card.

There are not many motherboards with a PCIe 4x slot. Even high end motherboards usually have more PCIe 16x slots and some or none PCIe 1x slots. The user will be able to install an add-on card with a PCIe 4x connector into a PCIe 16x slot, but that would be one PCIe 16x slot not available for a video card. If more such slots are available, the user only gives up a multi video card setup like SLI or CrossFire. If just one PCIe 16x slot is available and no on board video with all the other PCIe slots being 1x, the situation becomes impossible.

Here is such PCIe 4x USB 3.0 add-on card, but the fact that for a long (let’s say 5 meters) connection with two devices you need two USB 3.0 that each are 5 meters long is a clear disadvantage. What if you could take a PCIe “slot” 5 meters out of your system and then mount this USB 3.0 add-on card on it?

Moreover, what if you’d like to have a small box, full with PCIe “slots”, meters away from your motherboard, and you’d be able to connect to it using just one single cable while having many different devices connected througt it, directly to the PCIe BUS?

One example of such a "small" box, with PCIe “slots” in it, is Apple’s Thunderbolt display. Thunderbolt solves this by simply taking a number of “virtual” PCIe slots and moving them outside the system. But more on how Thunderbolt works and what it brings new to the industry in the next part of our Intel Thunderbolt presentation articles.

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LTE-Enabled Samsung SHV-E170K Coming Soon to South Korea

South Korean carrier KT has just announced the upcoming availability of three LTE-enabled smartphones. Among them, KT mentioned a certain Samsung SHV-E170K handset, which we never heard before.

According to the folks over at SammyHub, the SHV-E170K is an Android top-tier smartphone that runs the latest Ice Cream Sandwich operating system.

Although KT did not reveal the phone’s specs sheet, it appears that the handset is equipped with a dual-core Qualcomm Snapdragon S4 processor clocked at 1.5 GHz. 

In addition, the SHV-E170K boasts a larger 4.3-inch qHD Super AMOLED capacitive touchscreen display that supports 540 x 960 pixels resolution.

Samsung SHV-E170K comes with dual camera, 5-megapixel rear photo snapper and 1.3-megapixel front facing camera for video calls. Rumor has it that KT and Samsung plan to launch this smartphone later this month.

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NVIDIA Releases GeForce 405M GPU

NVIDIA has been weaving a nice spell over the past few months, releasing the GeForce GTX 680 and, more recently, the GTX 670, so it is with great bemusement that we report on the company's newest action.

To its credit, the company knew it would leave people confused, if not baffled, when it sent out the newest GPU, so it kept things more or less quiet.

Still, this was bound to come out eventually. It just so happens that “eventually” came around faster than anyone had expected this once. We may as well stop beating around the bush and just say it: NVIDIA has released the GeForce 405M graphics processing unit.

That's right, even though any Advanced Micro Devices APU, Llano or Trinity, can wipe the floor with any entry-level GPUs, NVIDIA released one anyway. If we were to guess, the Intel GMA HD 4000 might be better than the 405M too, but we haven't conducted any Ivy Bridge tests to see if that is true, so we aren't sure.

GeForce 405M is the weakest GPU in the Santa Clara, California-based company's arsenal, featuring only 16 CUDA cores. To get an idea of what this means, the GTX 670 has 1,344 and GTX 680 has 1,536 CUDA cores. 

The shader processor clock is 1,212 MHz, which leads us to believe that the GPU clock is 606 MHz.  Moving on, there are 512 MB of DDR3 available, operating at 800 MHz (1.6 GHz effective) and a 64-bit interface.

As for TMUs and ROPs, NVIDIA hasn't disclosed them, but they are highly likely to be two and four, respectively. If NVIDIA scores any design wins for the GeForce 405M, it will only be in cheap, low-power systems and consumer electronics. Seeing as how this is the slowest GPU, it is probably the least power-hungry of NVIDIA's products too, so at least there's that.

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Micron Confirms Plan to Buy Elpida for $3.75 Billion

It was only a few days ago that we reported on who was left to bid for Elpida and, now, we finally have confirmation: Micron will acquire the company entirely. 

From being one of the prime suppliers of semiconductors, Elpida has somehow fallen to the level of bankruptcy very quickly over the past year and a half. 

Truly, many people didn't expect the company to ever reach such dire straits, but here we are. Back on February 27, 2012, it filed a petition for commencement of Corporate Reorganization Proceedings with the Tokyo District Court under the Corporate Reorganization Act of Japan. 

A bidding process followed, meant to secure a so-called sponsor that would acquire the business and help during the period or reorganizations. SK Hynix was one of the bidders, but it backed out a week ago, after most others had done the same. 

Eventually, Micron was left, and the official confirmation that it will fully acquire Elpida Memory is finally here. As part of the transaction, the latter will receive $2.5 to $3.75 billion, or 1.93 to 2.90 billion Euro. Meanwhile, Micron will become the second largest supplier of DRAM chips, right on the heels of Samsung Electronics. Quite the jump from fourth spot, and ironic too, considering that Elpida was actually ahead, on third place, in the first quarter of 2012. 

As for the market as a whole, the web keeps talking about the DRAM industry becoming an oligopoly, with only three major suppliers (Samsung, SK Hynix, Micron). No longer will price wars lead to such cheap memory modules and kits. In other words, consumers will be getting the short end of the stick, so they probably should get a nice RAM kit now. DDR4 will only appear in 2013 or 2014 and we doubt it will ever be as cheap as DDR3 is today.

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Tizen-Based Samsung GT-I9500 Boasts Super AMOLED HD Plus Display

With the Galaxy S III announcement, we thought that Samsung will stop releasing top tier phones for a short while. However, it appears that the South Korean company is about to launch a brand new Tizen smartphone.

The so-called Samsung GT-I9500 smartphone is the first of its kind to run Tizen OS. The device was offered for free to Tizen devs at a recent event that took place in San Francisco, United States.

Although details on the phone’s specs sheet are scarce for the moment, the folks over at Sammobile have learned that the Tizen-based GT-I9500 boasts an impressive Super AMOLED HD Plus capacitive touchscreen display of unknown size (4.6 or 4.8-inch).

This is the same kind of display that was rumored for Galaxy S III, but in the end Samsung decided to go with the PenTile variant claiming longer lifespan. 

There are no other details on the GT-I9500, but we’re expecting more info to emerge in the following weeks. Stay tuned for more updates on the matter.

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Nokia 305 and 311 Full Touch S40 Feature-Phones Leak

We have been expecting news about Nokia’s first full touch S40 mobile phone for a few days. The first details on the unannounced device emerged last week via a Nokia invitation, which was sent to some Pakistani bloggers.

A certain Nokia 306 full-touch S40 mobile phone also leaked a month ago, but details on the configuration were scarce as well: microSD card slot, 1100 mAh Li-Ion battery, rear camera, 2 soft keys, FM Radio, GPRS support and microUSB.

Today, the folks over Chinese site Mobile01 got their hands on several live pictures of two feature-phones, which are dubbed Nokia 305 and 311.

We expect more details to be unveiled next week at Nokia’s “Next Billion” event, which is set to kick off on May 15, in Pakistan. Stay tuned for more updates on the matter. via MyNokiaBlog

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Apple’s iOS 6 Maps Application Detailed - 3D Street View

Thanks to the acquisition of three companies specializing in mapping technologies, Apple can finally unleash its proprietary Maps application in iOS 6, trusted sources have revealed.

Speaking to the people at 9to5mac, a reliable source in and of itself, these sources said the application design is fairly similar to the current Google Maps app running on all iPhones and iPads in iOS 5.

Apple’s Maps, however, is described as “a much cleaner, faster, and more reliable experience.” The service is the brainchild of three mapping companies strategically acquired by Apple with intentions to ditch Google’s mapping service. Apple’s will not only be proprietary, and therefore more reliable with respect to iOS, but it will also have 3D capabilities. Buckle up!

Of the three companies acquired by Apple with this purpose - Placebase, C3 Technologies, and Poly9 - one in particular has allowed Apple to design a 3D database much like Google’s street view, only more realistic (examples in the photo above, and the video embedded below).

Before moving its IPs over to Apple Inc., C3 Technologies described its 3D street view capability as follows:

C3 Technologies is the leading provider of 3D mapping solutions, offering photo-realistic models of the world for search, navigation and geographic information systems. Since 2007 when it was spun out of the aerospace and defense company Saab AB, venture-backed C3 has redefined mapping by applying previously classified image processing technology to the development of 3D maps as a platform for new social and commercial applications. The Sweden-based company’s automated software and advanced algorithms enable C3 to rapidly assemble extremely precise 3D models, and seamlessly integrate them with traditional 2D maps, satellite images, street level photography and user generated images, that together are forever changing how people use maps and explore the world.

The 3D mode reportedly doesn’t come enabled by default, but users can switch it on thanks to a handy 3D button in the app.

iOS 6 is set to be showcased at Apple’s annual developer-centric event in June, and perhaps even released to developers as a preview (beta).

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Giada Presents the Mini PC Giada A51 Powered by AMD’s Brazos

Mini IT component manufacturer SHENZHEN JIEHE TECHNOLOGY DEVELOPMENT CO., LTD. or just JEHE, better known as Giada, has just launched the Mini PC Giada A51 micro system, on its official website.

The Mini PC Giada A51 is using AMD’s Brazos family member E450. This is a low power dual core CPU using two Bobcat cores and a AMD Radeon HD 6320 iGPU.

It is manufactured at TSMC using the mature 40 nm manufacturing process and works at a default 1650 MHz frequency in a BGA413 FT1–type socket.

To understand just how small Brazos is, it is enough to say that the whole processor is just 19 by 19 millimeters.

It comes with just 1 MB or Level 2 cache that’s being split between the two cores, but it is well-endowed with 80 VLIW5 shades running at a default 508 MHz, with a turbo mode option of 600 MHz.

The cool, 18 watts TDP CPU is able to handle DDR3-1333 memory, although Giada has just one SODIMM slot available with a maximum frequency of 1066 MHz.

On the storage side, there is a 320 GB HDD in 2.5” format and some extra space can be added using the five USB slots out of which just one is USB 3.0 and the Card Reader.

Connectivity is completed with a HDMI port, a VGA connector, one SPDIF, WiFI N class, Bluetooth, Gigabit LAN and two audio jacks.

The whole system will consume a maximum of 30 watts of power and the whole device only measures 192 by 155 by 26 millimeters. That’s about 7.55 by 6.1 by 1 inches.

The official US pricing doesn’t seem to be available yet, but in Europe, on Giada’s German site, the Mini PC Giada A51 is listed for 307 EUR, just the same price as its lower performing brother powered by Intel’s measly Atom.

The European price would translate into about 400 USD, but we expect Giada will price the Mini PC Giada A51 a little bit lower for the new continent.

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ASUS ZenBook UX32VD Officially Priced at $799 USD

The official pricing of Asustek’s highly-anticipated ZenBook UX32VD has reportedly been revealed to be 799 USD. The price is a little bit higher than the desired 599 to 699 USD mark, but the ZenBook tried to compensate with a high quality build and innovative features, such as a 24 GB SSD.

The 24 GB SSD is very close to the 20:1 ratio that Intel and WD agree will achieve over 95% cache hit rate. This should prove much better results than Seagate’s overpriced and unimpressive hybrid drives.

Overall, using Nvidia’s measly GT620, the new ZenBook is put at disadvantage when compared with traditional notebooks sold at lower price points, but we must state again that the ZenBook UX32VD is a unique product with very good design, along impressive size and weight specifications.

The price of 799 USD Asustek wants for its new ZenBook represents around 620 EUR, as far as European customers are concerned.

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Raspberry Pi Firmware Updater Will Make Your Life Easier

The Raspberry Pi credit-card-sized Linux-loaded ARM computer has been shipping for a little while, and it was enough for developers to see just how frustrating it can be to have to constantly reinstall the firmware. 

Since the small device is primarily meant for teaching and experimenting with programming, mishaps can happen, which means that the core software doesn't always come out scot-free. 

Developer Hexxeh decided it was time to simplify the reinstall and update process, so he released a small tool that does just that. He doesn't even want anything in exchange for it, so go here and download it if you have one of those critters. 

If you still haven't received your order, all we can say is hold on because it will reach you eventually. RS and Allied Electronics are doing their best. Probably.

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Nokia Lumia 850 Concept Phone Emerges

Finnish mobile phone maker Nokia has already released a handful of Windows Phone devices, but some more of them should make it to the shelves in the not too distant future. 

Among them, we might see one that closely resembles the Nokia Lumia 850 handsets in the photos attached to this post. 

It is only a concept handset for the time being, but it is a good looking one, and could win the hearts of many if indeed manufactured and released. 

The concept phone packs a 3.8–inch curved display, while featuring a polycarbonate unibody with edgeless design. Of course, the handset runs under Windows Phone, just as all devices in Nokia’s Lumia series. 

The concept comes from BrianMFB, a designer from Luxembourg (via TheNokiaBlog). Make sure to click on the images below to see them in full size.

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Intel's Sub-Par Ivy Bridge Cooling Busted

For some reason or other, Intel chose to use common thermal grease between the Ivy Bridge CPUs and their integrated heatspreader (IHS). What people didn't realize was that said grease was of a fairly low quality too. 

We should first mention that the temperature Ivy Bridge works at isn't really a hazard, but we have to wonder why Intel allowed this situation to happen. These are high-end, expensive chips, not cheap models where every cut corner counts. 

It was back in late April when we reported on that intentional design change that has been acknowledged as the cause behind the operational temperature of Ivy Bridge CPUs. It might not have even been noticed if Sandy Bridge hadn’t run cooler. 

Rather than fluxless solder, the Santa Clara, California-based company put common thermal compound between the chip and the IHS. We just never noticed how sub-par it was. 

Fortunately, the folks at Impress PC Watch embarked upon a quest to find out precisely that, and the results aren't at all flattering. After wiping away the thermal grease, they tested the Core i7-3770K with OCZ's Freeze Extreme and Coollaboratory's Liquid Pro. 

The latter supposedly offers 82W/mk of thermal conductivity, which is better than OCZ's Freeze Extreme, and that's saying something. One would expect us to be setting up a great reveal, where Intel's solution was better than OCZ's but weaker than Liquid Pro. 

Alas, that is not the case. Instead, Impress PC Watch found both alternatives to be vastly superior to the default grease. When running at 3.5 GHz, the Core i7-3770K quad-core high-end chip ran at 8 degrees Celsius less on Freeze Extreme and 11 degrees less with Liquid Pro. Moreover, a 4.6 GHz overclock led to an even higher difference, of 15 and 20 degrees, respectively. 

Thermalright Silver Arrow SB-E was employed during the tests, so the gaps could vary depending on whatever other CPU cooler is present. Be advised, though, that removing the integrated heatspreader of a CPU can damage the CPU die and will void the warranty in any case. Test at your own risk.

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Gigabyte’s WindForce 3x GeForce GTX670 Video Card Is Official

Well-known Taiwanese motherboard manufacturer Gigabyte has just announced the GeForce GTX 670 WindForce 3X custom video card on its official website. We’ve already seen and talked about the design here.

It’s called GV-N670OC-2GD and comes with the company’s quality UltraDurable VGA+ PCB. The PCB has two oz copper layers, along with electrical ripple control, ferrite core chokes, low RDS MOSFETs and Japanese solid-state capacitors.

Right form the factory, the card comes moderately pre-overclocked to 980 MHz core, 1058 MHz GPU Boost and the usual 6.00 GHz effective GDDR5 memory frequency.

The three fans have a 90-millimeter diameter, and the connectivity side comes with two dual-link DVI ports along with a HDMI and a DisplayPort connector.

Pricing is quite good and stands at 415 USD for the US buyers. The European gamers will have to shell out around 320 EUR for the WindForce 3X.

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Windows 8 on ARM Is Flawed, Intel Believes

Windows 8, the next-generation operating system from Microsoft, will be the first to arrive with support for ARM architectures as well, in addition to the x86 architecture that it already runs on. 

Dubbed Windows RT, Windows on ARM will pack most of the features that the rest of Windows 8 flavors will include, but it will still lack some important functions. 

For example, it won’t bring along support for legacy applications, which will be a bit of a problem for ARM devices, Intel claims. 

During a meeting with investors at Intel’s headquarters in Santa Clara, California, Intel CEO Paul Otellini reportedly suggested that Windows 8 is flawed on ARM devices. 

The issue with these ARM PCs is that they won’t provide users with the Classic Windows environment that users have been already accustomed with, he said. 

Intel-based machines running Windows 8 will have this feature, which will pose a great advantage when it comes to competing with ARM architectures.

"With one button you can get to legacy mode...this is critically important for CIOs who want to preserve all of their investments in software," Otellini reportedly stated, referring to a Windows 8 ultrabook it was demonstrating. 

Concerns on Windows RT’s ability to satisfy user’s needs have been raised before as well. In fact, some software companies suggested that their applications won’t be able to deliver the intended experience on this platform version. 

On ARM devices, only the Metro environment will be available for users, although there will be some apps capable of running in the Classic Windows mode as well, namely Microsoft Office and Internet Explorer 10. 

Yesterday, Mozilla and Google shouted their discontent with this, claiming that their Firefox and Chrome browsers, respectively, would be confined to the Metro UI on Windows RT, without even benefiting from full access to the APIs needed to make them competitive, modern browsers. 

This is not the first time that x86-based Windows 8 devices are said to come with a great advantage over ARM ones. 

However, while this has been mainly analyst talk until now, it appears that hardware makers are also starting to see the benefits of offering support for legacy apps and for the desktop mode on their Windows 8 computers.

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LG LS970 (Eclipse 4G LTE) Leaks Online with 2GB of RAM

Last week, South Korean mobile phone maker LG Electronics unveiled to the world a new smartphone powered by Android, the LG Optimus LTE2, the first in the world to pack 2GB of RAM inside. 

The handset was made official only for the South Korean market, and LG did not unveil plans to have it available on other markets around the world as well. 

However, it appears that the handset vendor might have another smartphone coming to shelves soon with the same amount of RAM, and that it could prove an international device. 

Sporting model number LS970, this device is said to arrive on shelves as the LG Eclipse 4G LTE, yet nothing has been confirmed on this for the time being. 

However, the guys over at BriefMobile managed to unveil some of the device’s hardware specifications, and they also got hold of a leaked photo with it, though seen only from the back. 

Apparently, the device is powered by a 1.5 GHz Qualcomm APQ8064 application processor, a powerful quad-core Snapdragon S4 chip (a Krait design) that also includes the Adreno 320 GPU. 

Other rumored specs of this handset include a large 4.7-inch LCD TFT display capable of delivering a 1280 x 768-pixel resolution, as well as 16GB of internal storage. The phone shuold be powered by a 2100 mAh battery.

On the back, the new mobile phone is said to sport a 13-megapixel photo snapper, most probably with support for HD video recording, complemented by a 1.3MP camera on the front, great for making video calls. 

The leaked hardware specs also indicate that the device would offer support for LTE band 25, which would make it fit for Sprint’s network (hence the supposition that it could be launched as the LG Eclipse 4G LTE). 

Since no official confirmation on this smartphone has emerged until now, we’ll take the info on it with a grain of salt. However, we’ll keep an eye out for additional details on it, so stay tuned for more.

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Intel Haswell Mobile Chipsets Revealed

Intel's third-generation of central processing units hasn't even been fully launched yet, but already there is information on the next generation of processors and accompanying chipsets. 

For those who haven't guessed it yet, by “next-generation” CPUs we mean the Haswell series, the ones that will even introduce DDR4 support eventually. 

Sure, the first Haswell, bound for 2013 release, won't have that asset, but the Haswell-EX series will, starting in 2014. 

We've seen the web uncover quite a few other bits and pieces of information about Haswell, down to DirectX 1.1 support and 4th-Level On-Package cache for the GPU. 

Most recently though, VR-Zone claims to have learned the names of the chipsets that will support the mobile range of processors. 

There will be five in total, instead of the seven that Ivy Bridge notebook chips can land on. General consumer notebooks will use the HM87, HM85 or HM80 platform, while business laptops will receive the QM87. Ultrabooks will boast a special chipset called UM83. 

Indeed, Ultrabooks will have a unique hardware layout among notebooks, although the underlining platform concept is the same. 

HM87 and QM87 will support both Intel Smart Response technology (SSD caching) and RAID storage configurations. No explanation exists for why the former won't be included in all five, despite its usefulness. 

For those who've yet to get up to speed on the technology, SSD caching works by “merging” an HDD and an SSD together. As in the BIOS can make the OS think they are a single storage entity, thus combining the data capacity of the former with the speed of the latter. 

The report mentions that, in addition to the above, there will be a single-chip part in the series, an SoC of sorts (system-on-chip), with the CPU, GPU and the Lynx Point LP (Low Power probably) on the same package. We'll keep an eye out for further details.

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