Micron Technology Reveals 1 GHz 2 Gb and 4 Gb, 30nm DDR3

The other times we wrote about micron DRAM, we usually referred to the likelihood of new chips being employed in better notebook and desktop modules, but the company is aiming for something else this once.

Sure, its new DDR3 devices will be perfectly possible to use in normal DIMMs and SO-DIMMs, but as secondary purpose. The fields that the new DDR3 devices are aimed at are those of high-performance networking and discrete graphics. In other words, the new chips will be used in SoCs (system-on-chip devices) and GPUs. "We continue to build an aggressive portfolio for the performance-focused graphics market," said Matt Skynner, corporate vice president and general manager, AMD Graphics. "With Micron's new DDR3 devices we expect to drive even more performance." Micron's new chips have 2 Gigabit (Gb) and 4 Gigabit (Gb) capacities, as well as a clock speed of 1 GHz.

In addition to AMD, LSI is said to have partnered with Micron for the use of the DRAm in their products. "High-speed DDR3 will be powering the mainstream graphics and high-performance networking markets in 2012 and beyond. Micron is prepared to support these demanding markets by leveraging our expertise with high-volume, cost-efficient DDR3 products and developing these very high-performance DDR3 devices," said Robert Feurle, vice president of DRAM marketing for Micron. "The combination of our advanced process technology and our commitment to the graphics and high-end computing markets has proven highly successful, and these new 30 nm 2 Gb and 4 Gb DDR3 products will continue to deliver on that promise." Besides the applications already specified, Micron will offer the 2,133 MT/s chips to makers of network-specific ECC UDIMMs. Samples are already shipping and mass production should start soon.

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