2/22/2012 07:01:00 PM
dannzfay
Shortly after LG officially introduced the Optimus 3D Cube in South Korea, the handset maker revealed another version of its Optimus 3D sequel, the LG Optimus 3D Max. The latter will be showcased at this year’s Mobile World Congress trade fair.
For unknown reasons, LG decided to go underground at the MWC 2012. There aren’t any big launch events or conferences announced for the exhibition.
Official word is that the company decided to keep its meetings small, which is one of the reasons some of the European media wasn’t invited.
LG Optimus 3D Max is a very small step forward compared to the previous Optimus 3D model, which still stands out when it comes to hardware configuration.
Unfortunately, the lack of software support, such as new Android updates made LG fans turn to other brands that offer better support and probably better devices.
Unlike the original Optimus 3D that embeds a dual-core processor clocked at 1GHz, the new Optimus 3D Max is equipped with a slightly better 1.2 GHz dual core TI OMAP4430 CPU.
Although the smartphone comes with Android 2.3 Gingerbread on board, LG promises an Ice Cream Sandwich upgrade will be deployed shortly after launch.
Obviously, there’s no telling what “shortly” means for LG, so expect this one to have Android 4.0 at some point this year.
Aside from 3D capabilities (glasses-free), the Optimus 3D Max packs a 4.3-inch 3D WVGA capacitive touchscreen display with Corning Gorilla Glass 2 coating.
Nothing has changed on the inside, as the Optimus 3D Max will be delivered with 8GB of internal memory, 1GB of RAM and microSD card slot for memory expansion (up to 32GB).
In the connectivity front, the smartphone offers HSPA+ support, LG Tag+ capabilities, HDMI connection via MHL, as well as DNLA for wireless connection with TV/PC (3D video also supported).
According to LG, the Optimus 3D Max will be introduced in South Korea in March and will gradually be rolled out in other markets starting in Europe.
Posted in: 
0 comments:
Post a Comment