1/12/2012 05:49:00 PM
dannzfay
Since it wasn't about to miss out on the opportunity that CES gave it, Kingston came along and put several products on display.
Predictably, since the HyperX line of memory modules has brought it a lot of fame over the years, its exhibition includes new additions to the series.
VR-Zone reports three different types of HyperX memory.
One of the offerings, bearing the customary blue heatsink, is called HyperX T1 and caters to the needs of high-end customers.
Whenever Kingston decides they are ready to ship, they will feature high XMP 1.3 profiles, meaning that their overclocking headroom will be considerable.
The maximum capacity of each module is reported to be of 8GB.
Also, all of them are cooled by fairly thick and solid aluminum heatsinks, with vertically-extended fins.
The second RAM offering is a HyperX module whose heat spreader is red instead of blue.
It is called “HyperX Red Limited Edition” and, as mentioned above, has a top capacity of 8GB, plus the mainstream clock speed of 1,600 MHz.
“The enthusiast community knows the HyperX brand is synonymous with high speed, high quality and stylish design,” said Mark Tekunoff, senior technology manager, Kingston, in the press release issued at the start of CES 2012 (two days prior to the writing of this article).
“The new HyperX Red and the updated look of LoVo are great additions to our HyperX family. We have high-performance memory solutions to meet the specific needs of everyone from the entry-level gamer to the seasoned professional.”
Finally, Kingston held a demo of the HyperX Genesis quad-channel high-end memory kit for Sandy Bridge-E platforms.
It offers a total capacity of 64GB, meaning that it is made up of eight modules of 8 GB each.
The operational frequency is DDR3-2400 MHz, a truly high performance rating for such a capacity, especially given the thin heat spreaders.
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