CES 2012: Gigabyte Outs 7-Series Motherboards With 3D BIOS

Since CES is well underway, Gigabyte is eagerly demonstrating the new technologies that will make its motherboards much easier to interact with.

Though they were revealed some time ago, Gigabyte's 3D BIOS and 3D Power technologies are only now being publicly demonstrated.

With the 2012 edition of the Consumer Electronics Show (CES 2012) underway in Las Vegas, Nevada, Gigabyte arguably couldn't have hoped for a better opportunity.

The Gigabyte 3D BIOS technology is actually a new representation of the BIOS, with an interactive view of the mainboard itself.

Thus, even PC owners less versed in IT will be able to make heads or tails of what each component does.

Gigabyte even added helpful tips that pop up when the mouse hovers over a specific section of the motherboard.

Meanwhile, 3D Power grants full control over all main on-board power zones, with a digital PWM design and manipulation (and monitoring) of the CPU and socket power as well.

LGA 1155 motherboards, made for the second generation of Intel Core central processing units (CPUs), will possess these two technologies.

“We are very excited about the new technologies that will feature on our 7 series motherboards, and are confident that our customers will find them, together with the performance and feature improvements on Intel’s future platform, extremely appealing,” comments Henry Kao, Vice President of GIGABYTE Motherboard Business Unit. 

“Product development and debugging for the new features is progressing really well, and we expect to have a full range of products available globally by launch day.”

Gigabyte's CES exhibition includes the G1.Sniper 3 motherboard (has dual LAN) in ATX and Micro ATX form factors.

Finally, the company also brought a Bluetooth 4.0/Wi-Fi PCIe Card, which will be shipped along with select Gigabyte motherboards.

VR-Zone has some hands-on photos, for those interested, while official information may be found here.

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